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In recent years, high vacuum (HV) and ultra-high vacuum (UHV) manufacturing have become more widely adopted and advanced. This is partially due to the ease of access to functional HV/UHV components for advanced vacuum procedures.
Allectra manufactures, designs, and develops critical components for various sectors in the market, from nuclear fusion research to cryogenics. Within these is a proprietary collection of Sub-D feedthroughs.
Image Credit: Allectra Limited
ITT Canon designed D-sub-miniature connectors in the early 1950s as an innovative solution for peripheral computing connections. They were quickly deployed in industrial applications and are now used in telecommunications, consumer electronics, and even military apparatus.
The name originates from the design of the housing, which contains the pin connectors. The same tried-and-tested construction is used for Sub-D feedthroughs in vacuum applications.
Sub-D connections and feedthroughs are regulated by three main international standards: IEC807-2, MIL C-24308, and DIN 41652. All vacuum connection parts from Allectra are certified to the required degree of compliance, whether for use on the air-side or vacuum-side. These are supplied in a range of configurations, including:
Allectra understands that no two vacuum applications are the same. The specific objectives and requirements of each particular customer are taken into account to ensure that the Sub-D feedthrough is ideal for the application.
This information has been sourced, reviewed and adapted from materials provided by Allectra Limited.
For more information on this source, please visit Allectra Limited.
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